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Abstract: Today’s complex systems for high-performance computing feature chiplets using advanced packaging technologies, commercially known as EMIB, CoWoS, InFO, FOCoS, and several others from multiple sources.

Abstract: Today’s complex systems for high-performance computing feature chiplets using advanced packaging technologies, commercially known as EMIB, CoWoS, InFO, FOCoS, and several others from multiple sources.

Abstract: Resistive in-memory computing (IMC) architectures currently lag behind SRAM IMCs and digital accelerators in both energy efficiency and compute density due to their low compute accuracy. To understand the reasons underlying this trend, we develop a behavioral model of resistive IMCs to analyze the signal-to-noise-plus-distortion ratio (SNDR) of MRAM, ReRAM, and FeFET-based IMCs, employing parameter variation and noise models which are validated w.r.t.

Abstract: Resistive in-memory computing (IMC) architectures currently lag behind SRAM IMCs and digital accelerators in both energy efficiency and compute density due to their low compute accuracy. To understand the reasons underlying this trend, we develop a behavioral model of resistive IMCs to analyze the signal-to-noise-plus-distortion ratio (SNDR) of MRAM, ReRAM, and FeFET-based IMCs, employing parameter variation and noise models which are validated w.r.t.

Abstract: This workshop on Solid State Circuits and Devices in Radiation Environments explores the challenges and design techniques for developing reliable semiconductor components and integrated circuits for harsh radiation conditions, such as those encountered in space, nuclear, and high-energy physics environments. Participants will gain in-depth insights into the basics and latest advancements in radiation-hardened design approaches and technologies, with a focus on several key topics: 1.

Abstract: This workshop on Solid State Circuits and Devices in Radiation Environments explores the challenges and design techniques for developing reliable semiconductor components and integrated circuits for harsh radiation conditions, such as those encountered in space, nuclear, and high-energy physics environments. Participants will gain in-depth insights into the basics and latest advancements in radiation-hardened design approaches and technologies, with a focus on several key topics: 1.

Abstract: The next generation Internet of Things (IoT) envisions trillions of miniature devices that essentially disappear into the environment and objects around us, to improve our lives by measuring information from our world and routing it to stake-holders or connected devices that take action for our benefit. This talk describes how low power circuit design can enable this vision of a trillion-node IoT.

Abstract: The next generation Internet of Things (IoT) envisions trillions of miniature devices that essentially disappear into the environment and objects around us, to improve our lives by measuring information from our world and routing it to stake-holders or connected devices that take action for our benefit. This talk describes how low power circuit design can enable this vision of a trillion-node IoT.

Abstract: This is really a love story. Not about antique technology, but about a wild period of jaw-dropping creativity, the golden era of the bipolar transistor.

Abstract: This is really a love story. Not about antique technology, but about a wild period of jaw-dropping creativity, the golden era of the bipolar transistor.