Abstract Several versions of memory technologies have been implemented in today�s processor units and systems. Each have different specs for multiple level of utilizations. SRAM is preferred for embedded fast memory near processor unit, where (embedded) DRAM at the next level since it�s slower but denser than SRAM. On the other hand, NAND Flash has been the choice for Storage non-volatile memory due to its superb density and cost. Meanwhile, new memory technologies such as STTRAM and RRAM are emerging to compete with all types of volatile and non-volatile memory types due to its either density or lower power. Speaker Biography Fatih Hamzaoglu (SM 11) received the B.Sc. degree from the Middle East Technical University, Ankara, Turkey, in 1996, the M.S. degree from Clemson University, Clemson, SC, in 1998, and the Ph.D. degree from the University of Virginia, Charlottesville, in 2002, all in Electrical Engineering. After finishing the Ph.D., he joined Portland Technology Development, Intel Corporation, and since then, he has been working on low-power high-performance memory designs, including SRAM, DRAM and Non-Volatile Memories. Currently, he�s a Principal Engineer and leading the High Density Memory Group at Intel Corporation. He is the author or coauthor of more than 30 papers and inventor or co-inventor of more than 15 patents. Dr. Hamzaoglu participated in reviewing papers for VLSI SYMPOSIUM, IEEE JOURNAL OF SOLID STATE CIRCUITS, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS, IEEE TRANSACTIONS ON VLSI.