Abstract Embedded circuits and systems are facing today power issues due to technology scaling and many different variations sources. Flexibility and dynamic adaptation is required at circuit, system and technology levels to achieve high energy efficiency. This talk is focusing 3D technologies as a key enabler for flexibility and new architectural innovations, improving circuits overall performances. After a brief overview of available 3D technologies, new 3D flexible architectures are presented for digital and imager circuits. Learning and embedded intelligence using 3D is addressed as a promising perspective for 3D technologies. Speaker Biography Edith Beigne joined CEA-LETI, Grenoble, France, in 1998. She is the Research Director of Integrated Circuits and System Division at CEA LETI. Since 2009, she has been a senior scientist in the digital and mixed-signal design lab where she researches low power and adaptive circuit techniques, exploiting asynchronous design and advanced technology nodes like FDSOI 28nm and 14nm for many different applications from high performance MPSoC to ultra-low power IoT applications. Her main research interests today are low power digital circuits, neuro-inspired architectures and 3D integration. She is part of ISSCC TPC since 2014 and part of VLSI symposium since 2015. Distinguished Lecturer for the SSCS in 2016 and 2017, Women-in-Circuits Committee chair and JSSC Associate Editor since 2018.